In an effort to communicate the vital role that standards play in daily life, the American National Standards Institute (ANSI) publishes snapshots of the diverse standards initiatives undertaken in the global and national standards arena, many of which are performed by ANSI members and ANSI-accredited standards developers. Two of the latest selections follow:
Electrical Power Equipment Systems
According to the Association Connecting Electronics Industries (IPC), as the mobile electronics markets continue to see significant growth, there will be an increasing demand for product miniaturization and higher product performance expectation. To that end, the next generation of 3D assembly has many implementation challenges, since the technology is complex and requires process expertise that may require foundries, outsourced semiconductor assembly and test (OSAT) providers, and original design manufacturers (ODM).
The standard IPC-7091, Design and Assembly Process Implementation of 3D Components, intends to provide useful and practical information to those who are designing, developing, or using 3D-packaged semiconductor components or those who are considering 3D package implementation.
The 3D semiconductor package may include multiple die elements; some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components.
The standard was developed by IPC, the Association Connecting Electronics Industries, an ANSI member and accredited standards developer. IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies.