ANSI - American National Standards Institute
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ANSI Releases Paper Detailing Process for Developing U.S. Positions on ISO and IEC Issues

New York, Feb 26, 2009

The American National Standards Institute (ANSI) has released an explanatory information document on the process used to develop U.S. positions on issues and activities under consideration by the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC). The document is now available for download on ANSI’s online public library.

The paper offers detailed information about the mechanisms and processes used by ANSI and the U.S. National Committee to the IEC to develop consensus U.S positions at both the policy and technical levels.

When developing and determining official U.S. positions on ISO and IEC strategic, external relations, commercial, or financial policy matters, two governance groups are utilized: the ANSI ISO Council (AIC) and the USNC Council.

Technical management matters are handled by separate governance groups: the ANSI ISO Forum (AIF); and the USNC Technical Management Committee (USNC TMC).

Also detailed in the document are the steps followed when policy and technical issues relate to and affect both ISO and IEC. In this instance, the issue must be addressed in a coordinated and collaborative way, and all sectors of the ANSI and USNC constituencies should be appropriately represented.

Finally, the document outlines the development of official U.S. positions on ISO and IEC technical standards through the use of U.S. Technical Advisory Groups (TAGs). All materially affected and interested parties have the right to participate in a U.S. TAG, and there can be no undue financial barrier or membership requirement in another organization for participation.

To download the explanatory information document, click here.

For more information, contact Steven P. Cornish, ANSI senior director of international policy ( for ISO-related issues, or Rafa Lourenco, USNC/IEC deputy general secretary ( for IEC-related issues.

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