The National Institute of Standards and Technology (NIST) has released a report outlining the responses to a Request for Information (RFI) on potential semiconductor and microelectronics-related Manufacturing USA institutes.
The RFI, issued in October of 2022, sought public input on the development of up to three new Manufacturing USA institutes, intended to be public-private collaborations focused on technology, supply chain, and education and workforce development that would strengthen the semiconductor and microelectronics innovation ecosystem.
The initiative to develop new Manufacturing USA institutes is authorized under the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act.
After receiving more than 90 responses, mostly from organizations in the semiconductor sector, NIST developed a summary report with information compiled into five categories: institute scope; institute structure and governance; strategies for driving co-investment and engagement; education and workforce development; and metrics and success.
One question in the RFI centered on coordinating with standards development bodies on the need to modify existing or develop new standards as a result of this initiative. The report reads:
“The overwhelming majority of responders to this question suggested that the Manufacturing USA semiconductor institute(s) should coordinate and inform standards development bodies in three ways: role and coordination, focus areas, and standards organizations and engagement. For role and coordination, there was consensus that the semiconductor institute(s) should play a pivotal role to strategically participate, engage, and convene members particularly from industry to develop and promote standards that reflect technology advances in the semiconductor industry. Responses related to focus areas included design, manufacturing, testing, and packaging standards; equipment compatibility standards; supply chain diversity standards; quality standards; interoperability standard and HI using advanced packaging. Several responses suggested engagement with 39 standards organizations, namely Joint Electron Device Engineering Council, Institute of Electrical and Electronics Engineers Standards Association, Semiconductor Equipment and Materials International, Telecommunications Industry Association, UCIe, Semiconductor Industry Association, NIST, and International Electrotechnical Commission.”