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CHIPS for America Publishes “The Vision for the National Advanced Packaging Manufacturing Program,” Supporting Leadership and Technology Growth


In its latest effort to bolster U.S. semiconductor research and manufacturing, the Biden-Harris administration announced this week its vision to support U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors.

To provide an outline of the plan, CHIPS for America published “The Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), which elaborates on goals and investment areas to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S.

The CHIPS and Science Act, enacted in 2022, seeks to improve America's semiconductor capacity; promote domestic research and development; create regional tech hubs; and support a highly skilled and inclusive STEM workforce.

To that end, the DOC oversees $50 billion, aimed to revitalize the domestic semiconductor industry and bring supply chains back to the U.S., including $39 billion for manufacturing incentives and $11 billion for research and development programs.

“Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in America,” said U.S. Secretary of Commerce Gina Raimondo. “We need to make sure new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale, and packaged with the most advanced technologies. This new vision for advanced packaging will enable us to implement President Biden’s Investing in America agenda and make our country a leader in leading-edge semiconductor manufacturing.”

The vision reveals top priority research investment areas and their interdependencies, including materials and substrates; advances in equipment, tools, and processes; power delivery and thermal management; photonics and connectors; the development of a chiplet ecosystem; and the co-design of these multi-chiplet subsystems with automated tools.

The release of the NAPMP follows the DOC’s September announcement about a funding opportunity for smaller supply chain projects and businesses to access CHIPS for America funds.

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Jana Zabinski

Senior Director, Communications & Public Relations


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Beth Goodbaum

Journalist/Communications Specialist


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